About Us
Engineering Led
We are engineering-led. We respect and remain true to the science of sound.
Go to market approach
We streamline AI-enabled hearables, fastly integrated, reliably mass-produced.
Empowering Hearing
We pioneer next-generation technology for Face-to-Face conversation enhancement.
Sound Consciousness
We leverage our proprietary AI techniques to unleash personalized sound control.
Leading the Future of Smart Hearables
AI-Audio Portable Pioneers
With industry-leading expertise in AI-enabled active noise cancellation and reduction, Orosound Labs, the innovator behind Face-to-Face Conversation Technology, is at the forefront of developing powerful, seamlessly integrated AI-based platforms for the next-generation of smart hearables.
As a respected partner of audio OEMs, product integrators, and silicon providers, we are committed to supporting our customers’ design-in processes with powerful tools, reference designs, and comprehensive technical support. Our operations span across the consumer, smart device, and OTC markets, where we continue to drive innovation and excellence.
Driving Change in Face-to-Face Interaction
Advanced F2F Tech
Orosound Labs leads the way in hearing enhancement technology, offering the most advanced solution for headphone users seeking personalized audio experiences. With our cutting-edge F2F Technology, we excel at faithfully reproducing both users’ and their conversation partners’ voices while expertly reducing background noise.
This exceptional performance is the result of meticulous AI-based fine-tuning and ultra-low latency, creating a genuinely natural and uninterrupted conversational experience. Join us on this transformative journey to reshape the future of communication.
The People Behind Orosound Labs
Our leading team
Orosound Labs was brought to life by Eric Benhaim, a noted expert in Artificial Intelligence and signal processing, and Pierre Guiu, whose reputation was forged within the largest audio brands in Asia and Europe.
Pierre Guiu, CEO
Pierre Guiu has served as the CEO of Orosound Labs since 2015, overseeing the company’s consumer electronics and audio-related operations. He has 20-year experience in the audio market, with a strong engineering background, a large product track record for leading brands and several patents under his name.
Eric Benhaim, CTO
Eric Benhaim, Orosound’s CTO, has a background in computer science, signal processing and AI. Throughout his career, Eric has been involved in international R&D projects, including roles at Thales and EADS. He authored a doctoral thesis on visual speech analysis, as well as several international patents and conference publications.
In-House Technical Expertise
Our engineering teams
Alex B.
“At Orosound’s, we’re designing ambitious and innovative noise cancelling solutions with the aim of bringing user comfort, regardless of the headphones’ form factor.”
Benjamin C.
“We play a pivotal role in designing and developing the software within audio devices. This involves optimizing performance, and ensuring seamless functionality. From coding firmware to enhancing signal processing algorithms, our work directly impacts the audio quality, user experience, and overall product innovation.”
Alejandro S.
“At the junction of signal processing techniques and the promising machine learning methods, we use our expertise in audio processing to distillate the potential of neural networks into a new ecosystem of efficient, robust and compact algorithms, to provide the best sound quality in every device.”
Martin P.
“We offer our expertise and experience of the manufacturing processes and methods to convert requirements into physical products. We can propose state of the art materials and techniques, and go straight to samples thanks to our industrial partners.”
Adrien C.
“We provide mobile, desktop and cloud apps to enable real-time communication with your devices along with secure management APIs. From production line tools to complete cloud based infrastructures, our full stack expertise ensure seamless integration with your systems.”
Meet the team
Upcoming Events
-
Embedded World 2024
9-11th April 2024 in Nuremberg, Germany
-
Electronica China 2024
11-13th July 2024 in Shanghai, China